Film formation - Company Ranking(18 companies in total)
Last Updated： Aggregation Period:Sep 09, 2026〜Oct 06, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| High adhesion properties can be obtained through direct copper deposition on organic insulating materials and glass. | TGV film formation Circuit formation | ||
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サーマプレシジョン
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- Featured Products
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Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition.
- overview
- High adhesion properties can be obtained through direct copper deposition on organic insulating materials and glass.
- Application/Performance example
- TGV film formation Circuit formation
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サーマプレシジョン
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